Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12009288 | Interconnection structure and semiconductor package including the same | Junyun Kweon, Jumyong Park, Jin Ho An, Chungsun Lee, Hyunsu Hwang | 2024-06-11 |
| 11996358 | Semiconductor packages having first and second redistribution patterns | Ju-Il Choi, Jumyong Park, Jin Ho An, Chungsun Lee, Jeonggi Jin +1 more | 2024-05-28 |
| 11923309 | Semiconductor package including fine redistribution patterns | Hyunsu Hwang, Junyun Kweon, Jumyong Park, Jin Ho An, Chungsun Lee +1 more | 2024-03-05 |