Issued Patents 2024
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183664 | Semiconductor package | Ju-Il Choi, Gyuho Kang, Seong-Hoon Bae, Jeonggi Jin, Atsushi Fujisaki | 2024-12-31 |
| 12107063 | Semiconductor package device | Ju-Il Choi, Gyuho Kang, Heewon KIM, Junyoung Park, Seong-Hoon Bae | 2024-10-01 |
| 12040294 | Semiconductor devices and semiconductor packages including the same | Ju-Il Choi, Un-Byoung Kang, Jongho Lee, Jeonggi Jin, Atsushi Fujisaki | 2024-07-16 |
| 12014972 | Semiconductor devices including through-silicon-vias and methods of manufacturing the same and semiconductor packages including the semiconductor devices | Ju-Il Choi, Kwang-Jin Moon, Byung-Lyul Park, Atsushi Fujisaki | 2024-06-18 |
| 12009288 | Interconnection structure and semiconductor package including the same | Dongjoon Oh, Junyun Kweon, Jumyong Park, Chungsun Lee, Hyunsu Hwang | 2024-06-11 |
| 11996358 | Semiconductor packages having first and second redistribution patterns | Ju-Il Choi, Jumyong Park, Dongjoon Oh, Chungsun Lee, Jeonggi Jin +1 more | 2024-05-28 |
| 11923309 | Semiconductor package including fine redistribution patterns | Hyunsu Hwang, Junyun Kweon, Jumyong Park, Dongjoon Oh, Chungsun Lee +1 more | 2024-03-05 |