Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12170259 | Semiconductor package and method of fabricating the same | Ju Bin SEO, Seok Ho Kim | 2024-12-17 |
| 12014972 | Semiconductor devices including through-silicon-vias and methods of manufacturing the same and semiconductor packages including the semiconductor devices | Ju-Il Choi, Byung-Lyul Park, Jin Ho An, Atsushi Fujisaki | 2024-06-18 |