Issued Patents 2024
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183664 | Semiconductor package | Ju-Il Choi, Seong-Hoon Bae, Jin Ho An, Jeonggi Jin, Atsushi Fujisaki | 2024-12-31 |
| 12119306 | Semiconductor package | Ju-Il Choi, Un-Byoung Kang, Byeongchan KIM, Junyoung Park, Jongho Lee +1 more | 2024-10-15 |
| 12119331 | Semiconductor package | Ju-Il Choi, Heewon KIM, Sechul Park, Jongho Park, Junyoung Park | 2024-10-15 |
| 12107063 | Semiconductor package device | Ju-Il Choi, Heewon KIM, Junyoung Park, Seong-Hoon Bae, Jin Ho An | 2024-10-01 |
| 12027482 | Semiconductor chip having a through electrode and semiconductor package including the semiconductor chip | Jeonggi Jin, Unbyoung Kang, Heewon KIM, Jumyong Park, Hyunsu Hwang | 2024-07-02 |