Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176313 | Semiconductor package | Hyoungjoo Lee, Sechul Park, Sangsick Park, Hyojin Yun, Teakhoon Lee +1 more | 2024-12-24 |
| 12027482 | Semiconductor chip having a through electrode and semiconductor package including the semiconductor chip | Jeonggi Jin, Gyuho Kang, Heewon KIM, Jumyong Park, Hyunsu Hwang | 2024-07-02 |
| 11967581 | Package structures having underfills | Jinwoo Park, Jongho Lee, Teakhoon Lee | 2024-04-23 |
| 11935832 | Semiconductor device and method of fabricating the same | Junyeong Heo, Donghoon Won | 2024-03-19 |