Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12176313 | Semiconductor package | Hyoungjoo Lee, Unbyoung Kang, Sechul Park, Sangsick Park, Hyojin Yun +1 more | 2024-12-24 |
| 11967581 | Package structures having underfills | Jinwoo Park, Unbyoung Kang, Jongho Lee | 2024-04-23 |
| 11923340 | Semiconductor package including mold layer and manufacturing method thereof | Yeongkwon Ko, Jinwoo Park, Jaekyung Yoo | 2024-03-05 |