Issued Patents 2024
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12165991 | Semiconductor package | Un-Byoung Kang, Jaekyung Yoo, Teak-Hoon Lee | 2024-12-10 |
| 12094794 | Semiconductor package and method of fabricating the same | Seunghun Shin, Junyeong Heo | 2024-09-17 |
| 12062639 | Semiconductor package and method of fabricating the same | Jaekyung Yoo, Jongho Lee | 2024-08-13 |
| 12002726 | Semiconductor package and method of manufacture | Jinwoo Park, Jongho Lee | 2024-06-04 |
| 11996367 | Semiconductor device and semiconductor package including the same | Jaeeun Lee, Junyeong Heo | 2024-05-28 |
| 11923343 | Semiconductor package and method of fabricating the same | Jaekyung Yoo, Jayeon LEE, Jae Eun Lee, Jin-Woo Park, Teak-Hoon Lee | 2024-03-05 |
| 11923340 | Semiconductor package including mold layer and manufacturing method thereof | Jinwoo Park, Jaekyung Yoo, Teakhoon Lee | 2024-03-05 |
| 11869821 | Semiconductor package having molding layer with inclined side wall | Seunghun Shin, Junyeong Heo | 2024-01-09 |