Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12165991 | Semiconductor package | Yeongkwon Ko, Un-Byoung Kang, Jaekyung Yoo | 2024-12-10 |
| 12113050 | Semiconductor package with increased thermal radiation efficiency | Sang-Sick Park, Un-Byoung Kang, Jongho Lee | 2024-10-08 |
| 12074141 | Semiconductor package | Seung-Hun Shin, Un-Byoung Kang, Yeong Kwon Ko, Jong Ho Lee, Jun Yeong Heo | 2024-08-27 |
| 11923343 | Semiconductor package and method of fabricating the same | Jaekyung Yoo, Jayeon LEE, Jae Eun Lee, Yeongkwon Ko, Jin-Woo Park | 2024-03-05 |