Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12165991 | Semiconductor package | Yeongkwon Ko, Un-Byoung Kang, Teak-Hoon Lee | 2024-12-10 |
| 12062639 | Semiconductor package and method of fabricating the same | Jongho Lee, Yeongkwon Ko | 2024-08-13 |
| 11923340 | Semiconductor package including mold layer and manufacturing method thereof | Yeongkwon Ko, Jinwoo Park, Teakhoon Lee | 2024-03-05 |
| 11923343 | Semiconductor package and method of fabricating the same | Jayeon LEE, Jae Eun Lee, Yeongkwon Ko, Jin-Woo Park, Teak-Hoon Lee | 2024-03-05 |