Issued Patents 2024
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183718 | Semiconductor package having a high reliability | Ji Hwan Hwang, Tae Hong Min, Geol Nam | 2024-12-31 |
| 12113050 | Semiconductor package with increased thermal radiation efficiency | Un-Byoung Kang, Jongho Lee, Teak-Hoon Lee | 2024-10-08 |
| 12074142 | Semiconductor package and method of fabricating the same | Jongpa HONG, Hwail Jin | 2024-08-27 |
| 11948903 | Semiconductor package | Un-Byoung Kang, Seon Gyo Kim, Joon Ho Jun | 2024-04-02 |
| 11901339 | Semiconductor package including a fillet layer | Min Soo Kim | 2024-02-13 |
| 11894346 | Semiconductor package having a high reliability | Ji Hwan Hwang, Tae Hong Min, Geol Nam | 2024-02-06 |