Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183718 | Semiconductor package having a high reliability | Ji Hwan Hwang, Sang-Sick Park, Tae Hong Min | 2024-12-31 |
| 11894346 | Semiconductor package having a high reliability | Ji Hwan Hwang, Sang-Sick Park, Tae Hong Min | 2024-02-06 |