Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183718 | Semiconductor package having a high reliability | Ji Hwan Hwang, Sang-Sick Park, Geol Nam | 2024-12-31 |
| 11894346 | Semiconductor package having a high reliability | Ji Hwan Hwang, Sang-Sick Park, Geol Nam | 2024-02-06 |
| 11864307 | Printed circuit board | Dae Jung Byun, Jung Soo Kim, Sang Hyun Sim, Chang Min Ha, Jin Won Lee | 2024-01-02 |