Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183718 | Semiconductor package having a high reliability | Sang-Sick Park, Tae Hong Min, Geol Nam | 2024-12-31 |
| 11894346 | Semiconductor package having a high reliability | Sang-Sick Park, Tae Hong Min, Geol Nam | 2024-02-06 |
| 11887900 | Semiconductor package including test pad | Hyuek Jae Lee, Tae Hun Kim, Ji Hoon Kim, Ji-Seok Hong | 2024-01-30 |
| 11887968 | Method of manufacturing a semiconductor package | Ji Hoon Kim, Ji-Seok Hong, Tae Hun Kim, Hyuek Jae Lee | 2024-01-30 |