Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11887900 | Semiconductor package including test pad | Tae Hun Kim, Ji Hwan Hwang, Ji Hoon Kim, Ji-Seok Hong | 2024-01-30 |
| 11887968 | Method of manufacturing a semiconductor package | Ji Hwan Hwang, Ji Hoon Kim, Ji-Seok Hong, Tae Hun Kim | 2024-01-30 |