Issued Patents 2024
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12040313 | Semiconductor package and a method for manufacturing the same | Hyuekjae Lee, Jihoon Kim, Jihwan Suh, So Youn Lee, Jihwan Hwang +1 more | 2024-07-16 |
| 12014977 | Interconnection structure, method of fabricating the same, and semiconductor package including interconnection structure | Dongwoo Kim, Hyunah KIM, Un-Byoung Kang, Chungsun Lee | 2024-06-18 |
| 11984425 | Semiconductor package | Jin-Woo Park | 2024-05-14 |
| 11887900 | Semiconductor package including test pad | Hyuek Jae Lee, Tae Hun Kim, Ji Hwan Hwang, Ji Hoon Kim | 2024-01-30 |
| 11887968 | Method of manufacturing a semiconductor package | Ji Hwan Hwang, Ji Hoon Kim, Tae Hun Kim, Hyuek Jae Lee | 2024-01-30 |