Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12040313 | Semiconductor package and a method for manufacturing the same | Hyuekjae Lee, Jihoon Kim, Jihwan Suh, Jihwan Hwang, Taehun Kim +1 more | 2024-07-16 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12040313 | Semiconductor package and a method for manufacturing the same | Hyuekjae Lee, Jihoon Kim, Jihwan Suh, Jihwan Hwang, Taehun Kim +1 more | 2024-07-16 |