Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12040313 | Semiconductor package and a method for manufacturing the same | Hyuekjae Lee, Jihoon Kim, So Youn Lee, Jihwan Hwang, Taehun Kim +1 more | 2024-07-16 |
| 11955449 | Stacked semiconductor package | Un-Byoung Kang, Taehun Kim, Hyuekjae Lee, Jihwan Hwang, Sang Cheon Park | 2024-04-09 |