Issued Patents 2024
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12132019 | Packaged multi-chip semiconductor devices and methods of fabricating same | Jongho Lee, Jihoon Kim, Taehun Kim, Sangcheon Park, Jinkyeong Seol +1 more | 2024-10-29 |
| 12040313 | Semiconductor package and a method for manufacturing the same | Jihoon Kim, Jihwan Suh, So Youn Lee, Jihwan Hwang, Taehun Kim +1 more | 2024-07-16 |
| 11984421 | Integrated circuit chip having BS-PDN structure | Eunseok Song, Hongjoo Baek, Kyungsuk Oh, Manho Lee | 2024-05-14 |
| 11955449 | Stacked semiconductor package | Jihwan Suh, Un-Byoung Kang, Taehun Kim, Jihwan Hwang, Sang Cheon Park | 2024-04-09 |
| 11901336 | Semiconductor package | Dae-Woo Kim, Eunseok Song | 2024-02-13 |