Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12132019 | Packaged multi-chip semiconductor devices and methods of fabricating same | Hyuekjae Lee, Jongho Lee, Jihoon Kim, Taehun Kim, Jinkyeong Seol +1 more | 2024-10-29 |
| 12094867 | Semiconductor package | Youngmin Lee | 2024-09-17 |
| 12080691 | Semiconductor devices | Sungwoo Park, Heonwoo Kim, Wonil Lee | 2024-09-03 |