Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12080691 | Semiconductor devices | Sungwoo Park, Sangcheon Park, Wonil Lee | 2024-09-03 |
| 11881456 | Semiconductor package including an interposer disposed on a package substrate and a capping structure disposed on the interposer | — | 2024-01-23 |