Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12132019 | Packaged multi-chip semiconductor devices and methods of fabricating same | Hyuekjae Lee, Jongho Lee, Jihoon Kim, Taehun Kim, Sangcheon Park +1 more | 2024-10-29 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12132019 | Packaged multi-chip semiconductor devices and methods of fabricating same | Hyuekjae Lee, Jongho Lee, Jihoon Kim, Taehun Kim, Sangcheon Park +1 more | 2024-10-29 |