Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12014977 | Interconnection structure, method of fabricating the same, and semiconductor package including interconnection structure | Ji-Seok Hong, Dongwoo Kim, Un-Byoung Kang, Chungsun Lee | 2024-06-18 |
| 12007144 | Ventilation apparatus and air conditioner including the same | Sungjune CHO, Hyungmo KOO, Youjae Kim, Joonhyoung KIM, Seonuk NA +3 more | 2024-06-11 |
| 11904266 | Filter assembly and air conditioning apparatus having the same | Donghyun Kim, Kwangnam SHIN, Jeongkyo OH | 2024-02-20 |