Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12094794 | Semiconductor package and method of fabricating the same | Yeongkwon Ko, Seunghun Shin | 2024-09-17 |
| 11996367 | Semiconductor device and semiconductor package including the same | Yeongkwon Ko, Jaeeun Lee | 2024-05-28 |
| 11935832 | Semiconductor device and method of fabricating the same | Unbyoung Kang, Donghoon Won | 2024-03-19 |
| 11869821 | Semiconductor package having molding layer with inclined side wall | Yeongkwon Ko, Seunghun Shin | 2024-01-09 |