Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12094794 | Semiconductor package and method of fabricating the same | Yeongkwon Ko, Junyeong Heo | 2024-09-17 |
| 11869821 | Semiconductor package having molding layer with inclined side wall | Yeongkwon Ko, Junyeong Heo | 2024-01-09 |