Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12119306 | Semiconductor package | Ju-Il Choi, Gyuho Kang, Un-Byoung Kang, Byeongchan KIM, Junyoung Park +1 more | 2024-10-15 |
| 12027482 | Semiconductor chip having a through electrode and semiconductor package including the semiconductor chip | Jeonggi Jin, Gyuho Kang, Unbyoung Kang, Heewon KIM, Jumyong Park | 2024-07-02 |
| 12009288 | Interconnection structure and semiconductor package including the same | Dongjoon Oh, Junyun Kweon, Jumyong Park, Jin Ho An, Chungsun Lee | 2024-06-11 |
| 11923309 | Semiconductor package including fine redistribution patterns | Junyun Kweon, Jumyong Park, Jin Ho An, Dongjoon Oh, Chungsun Lee +1 more | 2024-03-05 |