Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12009288 | Interconnection structure and semiconductor package including the same | Dongjoon Oh, Jumyong Park, Jin Ho An, Chungsun Lee, Hyunsu Hwang | 2024-06-11 |
| 11923309 | Semiconductor package including fine redistribution patterns | Hyunsu Hwang, Jumyong Park, Jin Ho An, Dongjoon Oh, Chungsun Lee +1 more | 2024-03-05 |