Issued Patents 2024
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12142541 | Semiconductor package | Jeonggi Jin, Jinho An, Taehwa Jeong, Jinho Chun, Juil Choi +1 more | 2024-11-12 |
| 12027482 | Semiconductor chip having a through electrode and semiconductor package including the semiconductor chip | Jeonggi Jin, Gyuho Kang, Unbyoung Kang, Heewon KIM, Hyunsu Hwang | 2024-07-02 |
| 12021034 | Semiconductor package and method of manufacturing the semiconductor package | Solji Song, Byeongchan KIM, Jinho An, Chungsun Lee, Jeonggi Jin +1 more | 2024-06-25 |
| 12009288 | Interconnection structure and semiconductor package including the same | Dongjoon Oh, Junyun Kweon, Jin Ho An, Chungsun Lee, Hyunsu Hwang | 2024-06-11 |
| 11996358 | Semiconductor packages having first and second redistribution patterns | Ju-Il Choi, Jin Ho An, Dongjoon Oh, Chungsun Lee, Jeonggi Jin +1 more | 2024-05-28 |
| 11978688 | Semiconductor device having via protective layer | Solji Song, Jinho An, Jeonggi Jin, Jinho Chun, Juil Choi | 2024-05-07 |
| 11923309 | Semiconductor package including fine redistribution patterns | Hyunsu Hwang, Junyun Kweon, Jin Ho An, Dongjoon Oh, Chungsun Lee +1 more | 2024-03-05 |