Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11862603 | Semiconductor packages with chips partially embedded in adhesive | Taewook Kim, Jongho Lee, Hyeon Hwang | 2024-01-02 |
JO
Jeongjoon Oh
Overall (2024): #420,120 of 561,600Top 75%
1
Patents 2024