Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11862603 | Semiconductor packages with chips partially embedded in adhesive | Taewook Kim, Jongho Lee, Jeongjoon Oh | 2024-01-02 |
HH
Hyeon Hwang
Overall (2024): #437,886 of 561,600Top 80%
1
Patents 2024