Issued Patents 2024
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12087696 | Semiconductor package | Taehwan Kim, Hyunjung Song, Hyoeun Kim, Wonil Lee, Sanguk Han | 2024-09-10 |
| 12021073 | Semiconductor package and method of manufacturing the same | Juhyeon Kim, Hyoeun Kim | 2024-06-25 |
| 11948851 | Semiconductor package including high thermal conductivity layer | Sunjae Kim, Eunsil Kang, Daehyun Kim | 2024-04-02 |
| 11942446 | Semiconductor package and method of manufacturing the same | Hyoeun Kim, Seunghoon Yeon, Chajea Jo | 2024-03-26 |
| 11935873 | Methods of inspection of semiconductor packages including measurement of alignment accuracy among semiconductor chips | Joonho Jun, Un-Byoung Kang, Jongho Lee, Young Kun Jee | 2024-03-19 |
| 11923342 | Semiconductor package | Sanguk Han, Chajea Jo, Hyoeun Kim | 2024-03-05 |
| 11869818 | Chip-stacked semiconductor package and method of manufacturing same | Hyoeun Kim, Yonghoe Cho, Seunghoon Yeon, Sanguk Han | 2024-01-09 |