Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11869818 | Chip-stacked semiconductor package and method of manufacturing same | Hyoeun Kim, Sunkyoung Seo, Seunghoon Yeon, Sanguk Han | 2024-01-09 |
| 11862596 | Semiconductor package | Namhoon Kim, Seunghoon Yeon | 2024-01-02 |