Issued Patents 2024
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11990452 | Semiconductor package | Namhoon Kim, Chajea Jo, Ohguk KWON, Hyoeun Kim | 2024-05-21 |
| 11942446 | Semiconductor package and method of manufacturing the same | Hyoeun Kim, Sunkyoung Seo, Chajea Jo | 2024-03-26 |
| 11887913 | Integrated circuit device and semiconductor package including the same | Chajea Jo, Ohguk KWON, Namhoon Kim, Hyoeun Kim | 2024-01-30 |
| 11869818 | Chip-stacked semiconductor package and method of manufacturing same | Hyoeun Kim, Yonghoe Cho, Sunkyoung Seo, Sanguk Han | 2024-01-09 |
| 11862596 | Semiconductor package | Namhoon Kim, Yonghoe Cho | 2024-01-02 |