Issued Patents 2024
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12051679 | Backside interconnection interface die for integrated circuits package | Woon-Seong Kwon, Teckgyu Kang | 2024-07-30 |
| 11990441 | Semiconductor package | — | 2024-05-21 |
| 11990452 | Semiconductor package | Chajea Jo, Ohguk KWON, Hyoeun Kim, Seunghoon Yeon | 2024-05-21 |
| 11978721 | ASIC package with photonics and vertical power delivery | Woon-Seong Kwon, Teckgyu Kang, Ryohei Urata | 2024-05-07 |
| 11889347 | Apparatus and method for uplink data report and control channel synchronization in wireless communication system | Sangkyu BAEK, Soenghun Kim, Myunghwan Kim, Hyoungmin Kim, Sungnam Hong | 2024-01-30 |
| 11887913 | Integrated circuit device and semiconductor package including the same | Chajea Jo, Ohguk KWON, Hyoeun Kim, Seunghoon Yeon | 2024-01-30 |
| 11862596 | Semiconductor package | Seunghoon Yeon, Yonghoe Cho | 2024-01-02 |