Issued Patents 2024
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12051679 | Backside interconnection interface die for integrated circuits package | Namhoon Kim, Woon-Seong Kwon | 2024-07-30 |
| 11990386 | Methods and heat distribution devices for thermal management of chip assemblies | Madhusudan K. Iyengar, Christopher G. Malone, Woon-Seong Kwon, Emad Samadiani, Melanie Beauchemin +6 more | 2024-05-21 |
| 11990461 | Integrated circuit package for high bandwidth memory | Nam Hoon Kim, Woon-Seong Kwon, Yujeong Shim | 2024-05-21 |
| 11978721 | ASIC package with photonics and vertical power delivery | Woon-Seong Kwon, Namhoon Kim, Ryohei Urata | 2024-05-07 |
| 11967538 | Three dimensional IC package with thermal enhancement | Woon-Seong Kwon, Xiaojin Wei, Madhusudan K. Iyengar | 2024-04-23 |
| 11955406 | Temperature control element utilized in device die packages | Yingying Wang, Emad Samadiani, Madhusudan K. Iyengar, Padam Jain, Xiaojin Wei +2 more | 2024-04-09 |