Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12051679 | Backside interconnection interface die for integrated circuits package | Namhoon Kim, Teckgyu Kang | 2024-07-30 |
| 11990386 | Methods and heat distribution devices for thermal management of chip assemblies | Madhusudan K. Iyengar, Christopher G. Malone, Emad Samadiani, Melanie Beauchemin, Padam Jain +6 more | 2024-05-21 |
| 11990461 | Integrated circuit package for high bandwidth memory | Nam Hoon Kim, Teckgyu Kang, Yujeong Shim | 2024-05-21 |
| 11978721 | ASIC package with photonics and vertical power delivery | Namhoon Kim, Teckgyu Kang, Ryohei Urata | 2024-05-07 |
| 11967538 | Three dimensional IC package with thermal enhancement | Xiaojin Wei, Madhusudan K. Iyengar, Teckgyu Kang | 2024-04-23 |