Issued Patents 2024
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12174676 | Modular liquid cooling architecture for liquid cooling | Jerry Chiu, Reza H. Khiabani, Xiaojin Wei | 2024-12-24 |
| 11990386 | Methods and heat distribution devices for thermal management of chip assemblies | Christopher G. Malone, Woon-Seong Kwon, Emad Samadiani, Melanie Beauchemin, Padam Jain +6 more | 2024-05-21 |
| 11991857 | Modular liquid cooling architecture for liquid cooling | Jerry Chiu | 2024-05-21 |
| 11967538 | Three dimensional IC package with thermal enhancement | Woon-Seong Kwon, Xiaojin Wei, Teckgyu Kang | 2024-04-23 |
| 11955406 | Temperature control element utilized in device die packages | Yingying Wang, Emad Samadiani, Padam Jain, Xiaojin Wei, Teckgyu Kang +2 more | 2024-04-09 |
| 11895807 | Thermal management of battery units on data center racks | Melanie Beauchemin, Christopher G. Malone | 2024-02-06 |