Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12148337 | Chip on film package with trench to reduce slippage and display device including the same | Jaemin Jung, Jeongkyu Ha, KwanJai Lee | 2024-11-19 |
| 12087696 | Semiconductor package | Sunkyoung Seo, Taehwan Kim, Hyunjung Song, Hyoeun Kim, Wonil Lee | 2024-09-10 |
| 11923342 | Semiconductor package | Chajea Jo, Hyoeun Kim, Sunkyoung Seo | 2024-03-05 |
| 11869818 | Chip-stacked semiconductor package and method of manufacturing same | Hyoeun Kim, Yonghoe Cho, Sunkyoung Seo, Seunghoon Yeon | 2024-01-09 |