Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12148337 | Chip on film package with trench to reduce slippage and display device including the same | Sanguk Han, Jaemin Jung, KwanJai Lee | 2024-11-19 |
| 12085990 | Chip-on-film package, display module including same, and electronic device including same | — | 2024-09-10 |