Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12148337 | Chip on film package with trench to reduce slippage and display device including the same | Sanguk Han, Jaemin Jung, Jeongkyu Ha | 2024-11-19 |
KL
KwanJai Lee
Overall (2024): #377,613 of 561,600Top 70%
1
Patents 2024