Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11948851 | Semiconductor package including high thermal conductivity layer | Sunjae Kim, Daehyun Kim, Sunkyoung Seo | 2024-04-02 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11948851 | Semiconductor package including high thermal conductivity layer | Sunjae Kim, Daehyun Kim, Sunkyoung Seo | 2024-04-02 |