Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11935873 | Methods of inspection of semiconductor packages including measurement of alignment accuracy among semiconductor chips | Joonho Jun, Un-Byoung Kang, Sunkyoung Seo, Jongho Lee | 2024-03-19 |
YJ
Young Kun Jee
Overall (2024): #207,432 of 561,600Top 40%
1
Patents 2024