Issued Patents 2024
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12068172 | Sacrificial pads to prevent galvanic corrosion of FLI bumps in EMIB packages | Tarek A. Ibrahim, Rahul N. Manepalli, Steve Cho, Jason M. Gamba, Javier Soto Gonzalez | 2024-08-20 |
| 12040276 | Device and method of very high density routing used with embedded multi-die interconnect bridge | Robert Alan May, Jonathan L. Rosch, Islam A. Salama, Kristof Darmawikarta | 2024-07-16 |
| 12014989 | Device and method of very high density routing used with embedded multi-die interconnect bridge | Robert Alan May, Jonathan L. Rosch, Islam A. Salama, Kristof Darmawikarta | 2024-06-18 |
| 12002762 | High density organic bridge device and method | Mihir K. Roy, Stefanie M. Lotz | 2024-06-04 |
| 11935805 | Package with underfill containment barrier | Rahul Jain, Kyu Oh Lee, Siddharth K. Alur, Vipul V. Mehta, Ashish Dhall +4 more | 2024-03-19 |
| 11923307 | Microelectronic structures including bridges | Bai Nie, Gang Duan, Omkar G. Karhade, Nitin A. Deshpande, Yikang Deng +6 more | 2024-03-05 |