Issued Patents 2023
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11832419 | Full package vapor chamber with IHS | Nicholas Neal, Nicholas S. Haehn, Je-Young Chang, Kyle Arrington, Aaron McCann +4 more | 2023-11-28 |
| 11817369 | Lids for integrated circuit packages with solder thermal interface materials | Bamidele Daniel Falola, Susmriti Das Mahapatra, Peng Li, Amitesh Saha | 2023-11-14 |
| 11798861 | Integrated heat spreader (IHS) with heating element | Peng Li, Kelly Lofgreen, Manish Dubey, Bamidele Daniel Falola, Ken Hackenberg +3 more | 2023-10-24 |
| 11791237 | Microelectronic assemblies including a thermal interface material | Peng Li, Yongmei Liu, Deepak Goyal, Ken Hackenberg | 2023-10-17 |
| 11776869 | Package with a highly conductive layer deposited on die using throughput additive deposition prior to TIM1 dispense | Feras Eid, Johanna M. Swan, John J. Beatty | 2023-10-03 |
| 11776864 | Corner guard for improved electroplated first level interconnect bump height range | Jacob VEHONSKY, Nicholas S. Haehn, Thomas HEATON, Steve Cho, Rahul Jain +4 more | 2023-10-03 |
| 11735552 | Microelectronic package with solder array thermal interface material (SA-TIM) | Debendra Mallik, Jimin Yao, Chandra Mohan Jha | 2023-08-22 |
| 11682605 | Integrated circuit packages with asymmetric adhesion material regions | Karthik Visvanathan, Shenavia S. Howell, Peng Li | 2023-06-20 |