Issued Patents 2023
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11842981 | Die interconnect substrates, a semiconductor device and a method for forming a die interconnect substrate | Ji-Yong Park, Kyu Oh Lee | 2023-12-12 |
| 11776864 | Corner guard for improved electroplated first level interconnect bump height range | Jacob VEHONSKY, Nicholas S. Haehn, Thomas HEATON, Steve Cho, Tarek A. Ibrahim +4 more | 2023-10-03 |
| 11735537 | Methods to embed magnetic material as first layer on coreless substrates and corresponding structures | Cheng Xu, Kyu Oh Lee, Junnan Zhao, Ji-Yong Park, Sai Vadlamani +1 more | 2023-08-22 |
| 11737208 | Microelectronic assemblies having conductive structures with different thicknesses | Brandon C. Marin, Andrew J. Brown, Dilan Seneviratne, Praneeth Akkinepally, Frank Truong | 2023-08-22 |
| 11664290 | Package with underfill containment barrier | Kyu Oh Lee, Siddharth K. Alur, Wei-Lun Kane Jen, Vipul V. Mehta, Ashish Dhall +4 more | 2023-05-30 |
| 11652071 | Electronic device package including a capacitor | Brandon C. Marin, Shivasubramanian Balasubramanian, Praneeth Akkinepally, Jeremy Ecton | 2023-05-16 |
| 11651902 | Patterning of thin film capacitors in organic substrate packages | Andrew J. Brown, Prithwish Chatterjee, Sai Vadlamani, Lauren A. Link | 2023-05-16 |
| 11610706 | Release layer-assisted selective embedding of magnetic material in cored and coreless organic substrates | Sai Vadlamani, Prithwish Chatterjee, Kyu Oh Lee, Sheng Li, Andrew J. Brown +1 more | 2023-03-21 |
| 11581271 | Methods to pattern TFC and incorporation in the ODI architecture and in any build up layer of organic substrate | Kyu Oh Lee, Islam A. Salama, Amruthavalli Pallavi Alur, Wei-Lun Kane Jen, Yongki Min +1 more | 2023-02-14 |
| 11557489 | Cavity structures in integrated circuit package supports | Sai Vadlamani, Junnan Zhao, Ji-Yong Park, Kyu Oh Lee, Cheng Xu | 2023-01-17 |