Issued Patents 2023
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11824008 | Multi-chip package and method of providing die-to-die interconnects in same | Chia-Pin Chiu, Aleksandar Aleksov, Hinmeng Au, Stefanie M. Lotz, Johanna M. Swan +1 more | 2023-11-21 |
| 11804455 | Substrate integrated thin film capacitors using amorphous high-k dielectrics | Aleksandar Aleksov, Thomas L. Sounart, Kristof Darmawikarta, Prithwish Chatterjee, Andrew J. Brown | 2023-10-31 |
| 11791528 | Low loss and low cross talk transmission lines with stacked dielectric layers for forming stubs of different thickness or for forming a coaxial line | Adel A. Elsherbini, Mathew J. Manusharow, Krishna Bharath, Zhichao Zhang, Yidnekachew S. Mekonnen +3 more | 2023-10-17 |
| 11764452 | Integrated circuit including a dielectric waveguide with a cavity therein surrounded by a conductive coating forming a wall for the cavity | Georgios Dogiamis, Adel A. Elsherbini, Telesphor Kamgaing, Johanna M. Swan | 2023-09-19 |
| 11756948 | In situ package integrated thin film capacitors for power delivery | Thomas L. Sounart, Aleksandar Aleksov | 2023-09-12 |
| 11728290 | Waveguide fan-out | Adel A. Elsherbini, Georgios Dogiamis, Johanna M. Swan, Aleksandar Aleksov, Telesphor Kamgaing | 2023-08-15 |
| 11721649 | Microelectronic assemblies | Adel A. Elsherbini, Patrick Morrow, Kimin Jun, Brennen Mueller, Shawna M. Liff +2 more | 2023-08-08 |
| 11716826 | Platforms including microelectronic packages therein coupled to a chassis, where waveguides couple the microelectronic packages to each other and usable in a computing device | Telesphor Kamgaing, Johanna M. Swan, Georgios Dogiamis, Adel A. Elsherbini, Aleksandar Aleksov +1 more | 2023-08-01 |
| 11715693 | Dielectric waveguide channel for interconnecting dies in a semiconductor package usable in a computing device and method of manufacture | Georgios Dogiamis, Aleksandar Aleksov, Adel A. Elsherbini, Johanna M. Swan, Telesphor Kamgaing | 2023-08-01 |
| 11664303 | Interconnection structure fabrication using grayscale lithography | Johanna M. Swan, Aleksandar Aleksov, Shawna M. Liff, Brandon M. Rawlings, Veronica Strong | 2023-05-30 |
| 11605603 | Microelectronic package with radio frequency (RF) chiplet | Adel A. Elsherbini, Georgios Dogiamis, Telesphor Kamgaing, Johanna M. Swan, Shawna M. Liff +1 more | 2023-03-14 |
| 11581272 | Contactless high-frequency interconnect | Adel A. Elsherbini, Georgios Dogiamis, Telesphor Kamgaing, Richard J. Dischler, Johanna M. Swan +1 more | 2023-02-14 |