Issued Patents 2021
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11192323 | Bonding structure of e chuck to aluminum base configuration | Roger Alan Lindley | 2021-12-07 |
| 11179965 | Electrostatic chuck optimized for refurbishment | Kadthala Ramaya Narendrnath | 2021-11-23 |
| 11158526 | Temperature controlled substrate support assembly | Konstantin Makhratchev, Masanori Ono, Zhiqiang Guo | 2021-10-26 |
| 11127619 | Workpiece carrier for high power with enhanced edge sealing | Kartik Ramaswamy, Chunlei Zhang, Haitao Wang, Jaeyong Cho | 2021-09-21 |
| 11088005 | Electrostatic chuck having thermally isolated zones with minimal crosstalk | Konstantin Makhratchev, Jason C. Della Rosa, Hamid Noobakhsh, Brad L. Mays, Douglas A. Buchberger, Jr. | 2021-08-10 |
| 11043360 | Gas distribution plate assembly for high power plasma etch processes | James D. Carducci, Kenneth S. Collins, Kartik Ramaswamy, Michael R. Rice, Richard Fovell | 2021-06-22 |
| 10973088 | Optically heated substrate support assembly with removable optical fibers | — | 2021-04-06 |
| 10957572 | Multi-zone gasket for substrate support assembly | — | 2021-03-23 |
| 10903094 | Electrostatic puck assembly with metal bonded backing plate for high temperature processes | — | 2021-01-26 |
| 10904996 | Substrate support with electrically floating power supply | Travis Koh, Haitao Wang, Philip Allan Kraus, Daniel Distaso, Christopher A. Rowland +2 more | 2021-01-26 |