Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11164723 | Methods and apparatus for etching semiconductor structures | Daisuke Shimizu, Taiki Hatakeyama, Sean S. Kang, Katsumasa Kawasaki | 2021-11-02 |
| 11127619 | Workpiece carrier for high power with enhanced edge sealing | Kartik Ramaswamy, Haitao Wang, Vijay D. Parkhe, Jaeyong Cho | 2021-09-21 |
| 10930471 | Methods and apparatus for etching semiconductor structures | Daisuke Shimizu, Taiki Hatakeyama, Sean S. Kang, Katsumasa Kawasaki | 2021-02-23 |
| 10930540 | Electrostatic chuck assembly having a dielectric filler | Kartik Ramaswamy, Anwar Husain, Haitao Wang, Evans Lee, Jaeyong Cho +3 more | 2021-02-23 |