Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11171030 | Methods and apparatus for dechucking wafers | Hamid Noorbakhsh, Haitao Wang, Sergio Fukuda Shoji | 2021-11-09 |
| 10930540 | Electrostatic chuck assembly having a dielectric filler | Kartik Ramaswamy, Haitao Wang, Evans Lee, Jaeyong Cho, Hamid Noorbakhsh +3 more | 2021-02-23 |