AG

Andrew M. Greene

IBM: 22 patents #141 of 11,274Top 2%
Globalfoundries: 4 patents #60 of 583Top 15%
TE Tessera: 3 patents #7 of 99Top 8%
ET Elpis Technologies: 1 patents #18 of 95Top 20%
Overall (2020): #1,134 of 565,922Top 1%
27
Patents 2020

Issued Patents 2020

Showing 1–25 of 27 patents

Patent #TitleCo-InventorsDate
10840345 Source and drain contact cut last process to enable wrap-around-contact Dechao Guo, Tenko Yamashita, Veeraraghavan S. Basker, Robert R. Robison, Ardasheir Rahman 2020-11-17
10818773 Trench silicide contacts with high selectivity process Balasubramanian Pranatharthiharan, Ruilong Xie 2020-10-27
10797154 Trench silicide contacts with high selectivity process Balasubramanian Pranatharthiharan, Ruilong Xie 2020-10-06
10790393 Utilizing multilayer gate spacer to reduce erosion of semiconductor Fin during spacer patterning Hong He, Sivananda K. Kanakasabapathy, Gauri Karve, Eric R. Miller, Pietro Montanini 2020-09-29
10790372 Direct gate metal cut using selective deposition to protect the gate end line from metal shorts Ekmini Anuja De Silva 2020-09-29
10790148 Method to increase effective gate height Heimanu Niebojewski, Ruilong Xie 2020-09-29
10770562 Interlayer dielectric replacement techniques with protection for source/drain contacts Kangguo Cheng, Juntao Li, Vimal Kamineni, Adra Carr, Chanro Park +1 more 2020-09-08
10741673 Controlling gate profile by inter-layer dielectric (ILD) nanolaminates Michael P. Belyansky, Fee Li Lie, Huimei Zhou 2020-08-11
10734234 Metal cut patterning and etching to minimize interlayer dielectric layer loss Kisup Chung, Ekmini Anuja De Silva, Siva Kanakasabapathy, Indira Seshadri 2020-08-04
10699965 Removal of epitaxy defects in transistors Ruilong Xie, Christopher M. Prindle, Pietro Montanini 2020-06-30
10692990 Gate cut in RMG Ruqiang Bao, Siva Kanakasabapathy 2020-06-23
10685866 Fin isolation to mitigate local layout effects Huimei Zhou, Gen Tsutsui, Dechao Guo, Huiming Bu, Robert R. Robison +2 more 2020-06-16
10672910 Threshold voltage adjustment from oxygen vacancy by scavenge metal filling at gate cut (CT) Huimei Zhou, Ruqiang Bao, Michael P. Belyansky, Gen Tsutsui 2020-06-02
10665589 Gate cut with integrated etch stop layer Marc A. Bergendahl, Rajasekhar Venigalla 2020-05-26
10658473 Gate cut device fabrication with extended height gates Kangguo Cheng, John R. Sporre, Peng Xu 2020-05-19
10658224 Method of fin oxidation by flowable oxide fill and steam anneal to mitigate local layout effects Huimei Zhou, Gen Tsutsui, Veeraraghavan S. Basker, Dechao Guo, Huiming Bu +1 more 2020-05-19
10644129 Gate cut in RMG Ruqiang Bao, Siva Kanakasabapathy 2020-05-05
10629699 Gate height control and ILD protection John R. Sporre, Stan Tsai, Ruilong Xie 2020-04-21
10622352 Fin cut to prevent replacement gate collapse on STI Balasubramanian Pranatharthiharan, Sivananda K. Kanakasabapathy, John R. Sporre 2020-04-14
10622482 Gate cut using selective deposition to prevent oxide loss Ekmini Anuja De Silva, Siva Kanakasabapathy 2020-04-14
10600868 FinFET gate cut after dummy gate removal John R. Sporre, Siva Kanakasabapathy, Jeffrey C. Shearer, Nicole Saulnier 2020-03-24
10600884 Additive core subtractive liner for metal cut etch processes Ruqiang Bao, Kisup Chung, Sivananda K. Kanakasabapathy, David L. Rath, Indira Seshadri +1 more 2020-03-24
10586706 Gate cut with high selectivity to preserve interlevel dielectric layer Ryan O. Jung, Ruilong Xie 2020-03-10
10580773 Gate cut with integrated etch stop layer Marc A. Bergendahl, Rajasekhar Venigalla 2020-03-03
10573646 Preserving channel strain in fin cuts Dechao Guo, Ravikumar Ramachandran, Rajasekhar Venigalla 2020-02-25