Issued Patents 2019
Showing 51–75 of 90 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10276501 | Formation of liner and metal conductor | Daniel C. Edelstein | 2019-04-30 |
| 10276649 | Metal resistors having nitridized dielectric surface layers and nitridized metal surface layers | Daniel C. Edelstein | 2019-04-30 |
| 10276503 | Surface treatment for semiconductor structure | — | 2019-04-30 |
| 10276435 | Advanced copper interconnects with hybrid microstructure | Daniel C. Edelstein | 2019-04-30 |
| 10256185 | Nitridization for semiconductor structures | Lawrence A. Clevenger, Roger A. Quon, Hosadurga Shobha, Terry A. Spooner, Wei Wang | 2019-04-09 |
| 10256145 | Semiconductor device and method of forming the semiconductor device | Lawrence A. Clevenger, Baozhen Li, Kirk D. Peterson, John E. Sheets, II, Junli Wang | 2019-04-09 |
| 10249501 | Single process for liner and metal fill | Praneet Adusumilli, Alexander Reznicek, Oscar van der Straten | 2019-04-02 |
| 10249724 | Low resistance contact structures for trench structures | Praneet Adusumilli, Alexander Reznicek, Oscar van der Straten | 2019-04-02 |
| 10249703 | Metal resistors having nitridized metal surface layers with different nitrogen content | Daniel C. Edelstein | 2019-04-02 |
| 10249702 | Metal resistors having varying resistivity | Daniel C. Edelstein | 2019-04-02 |
| 10249532 | Modulating the microstructure of metallic interconnect structures | Roger A. Quon, Michael Rizzolo | 2019-04-02 |
| 10242943 | Forming a stacked capacitor | Conal E. Murray | 2019-03-26 |
| 10236250 | Method for providing electrical antifuse including phase change material | — | 2019-03-19 |
| 10236257 | Cobalt top layer advanced metallization for interconnects | Daniel C. Edelstein | 2019-03-19 |
| 10236255 | Contact having self-aligned air gap spacers | Juntao Li, Junli Wang | 2019-03-19 |
| 10236251 | Method for providing electrical antifuse including phase change material | — | 2019-03-19 |
| 10229968 | Advanced metal insulator metal capacitor | — | 2019-03-12 |
| 10224281 | Metallic blocking layer for reliable interconnects and contacts | Praneet Adusumilli, Alexander Reznicek, Oscar van der Straten | 2019-03-05 |
| 10224275 | Copper interconnect structures | Lawrence A. Clevenger, Wei Wang | 2019-03-05 |
| 10224242 | Low-resistivity metallic interconnect structures | Stephan A. Cohen | 2019-03-05 |
| 10217664 | Reflow interconnect using Ru | Lawrence A. Clevenger, Su Chen Fan, Huai Huang, Koichi Motoyama, Wei Wang | 2019-02-26 |
| 10217809 | Method of forming resistors with controlled resistivity | Daniel C. Edelstein | 2019-02-26 |
| 10217725 | Microstructure modulation for metal wafer-wafer bonding | — | 2019-02-26 |
| 10211153 | Low aspect ratio interconnect | Benjamin D. Briggs, Elbert E. Huang, Raghuveer R. Patlolla, Cornelius Brown Peethala, David L. Rath | 2019-02-19 |
| 10211148 | Structural enhancement of Cu nanowires | Daniel C. Edelstein | 2019-02-19 |